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| 1-1-2 Switching Mode Regulator ICs SI-8000W Series Features * Surface-mount package (SOP8) * Output current: 0.6A * High efficiency: 75 to 80% * Requires only 4 discrete components Surface-Mount, Separate Excitation Step-down Switching Mode Regulator ICs Absolute Maximum Ratings Parameter DC Input Voltage Power Dissipation Junction Temperature Storage Temperature Thermal Resistance (Junction to 7-Pin Lead) Thermal Resistance (Junction to Ambient Air)*1 Symbol VIN PD Tj Tstg Ratings 35 1 -30 to +125 -40 to +125 22 100 Unit V W C C C/W C/W * Internally-adjusted phase correction and output voltage adjustment performed internally * Built-in reference oscillator (60kHz) * Built-in overcurrent and thermal protection circuits j-L j-a *1: Glass-epoxy board of 40 x 40mm (copper laminate area 4.3%) Applications * Power supplies for telecommunication equipment * Onboard local power supplies Recommended Operating Conditions Ratings Parameter DC Input Voltage Range Output Current Range Operating Junction Temperature Range Symbol VIN IO Tjop SI-8033W 5.3 to 28 0 to 0.6 -30 to +125 SI-8050W 7 to 33 Unit V A C Electrical Characteristics Ratings Parameter Symbol min. Output Voltage Efficiency Oscillation Frequency Line Regulation Load Regulation Temperature Coefficient of Output Voltage Ripple Rejection Overcurrent Protection Starting Current VO Conditions 3.17 SI-8033W typ. 3.30 VIN=15V, IO=0.3A 75 VIN=15V, IO=0.3A 60 VIN=15V, IO=0.3A 60 VIN=8 to 28V, IO=0.3A 20 VIN=15V, IO=0.1 to 0.4A 0.5 45 f=100 to 120HZ 0.61 VIN=15V 0.61 VIN=20V 30 80 max. 3.43 min. 4.80 SI-8050W typ. 5.00 VIN=20V, IO=0.3A 80 VIN=20V, IO=0.3A 60 VIN=20V, IO=0.3A 80 VIN=10 to 30V, IO=0.3A 30 VIN=20V, IO=0.1 to 0.4A 0.5 45 f=100 to 120HZ 40 100 max. 5.20 (Ta=25C) Unit V % kHZ mV mV mV/ C dB A Conditions f Conditions VOLINE Conditions VOLOAD Conditions VO/Ta RREJ Conditions IS1 Conditions 44 ICs SI-8000W Series External Dimensions (SOP8) 5.10.4 1.27 0.40.1 0.15+0.1 -0.05 (Unit : mm) 8 7 6 5 1 2 3 4 0.995max. 1.550.15 0~ 10 1.27 Pin Assignment q VIN w N.C e SWOUT r VOS t GND y GND u GND i GND Plastic Mold Package Type Flammability: UL94V-0 Product Mass: Approx. 0.1g 4.40.2 0.50.1 0.050.05 1.50.1 6.20.3 0.10 0.40.1 0.12 M Block Diagram VIN 1 OCP Reg. 3 SWOUT Typical Connection Diagram L1 200H VIN 1 VIN SWOUT 3 4 D1 SJPB-D4 (Sanken) + VO OSC Reset Drive Comp. TSD SI-8000W C1 100F + GND 5~8 VOS Amp. VREF 5~8 4 VOS C2 330F GND GND GND Reference Data Copper Laminate Area vs. Power Dissipation 1.2 Tj=100C Area of PC board : 40 x 40mm Ta=25C 1 Power Dissipation PD (W) Copper Laminate Area vs. Thermal Resistance j-a 140 Area of PC board : 40 x 40mm Ta=50C 120 Thermal Resistance j-a (C/W) Ta=80C 0.8 100 0.6 0.4 80 60 0.2 0 10 100 Copper Laminate Area (mm2) (GND Terminal) 1000 40 10 100 Copper Laminate Area (mm2) (GND Terminal) 1000 ICs 45 |
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